Basic Knowledge of Circuit Board Assembly: Regarding 3D Image Inspection
Strengths are "floating, tilting, and foreign objects"! Introducing the 3D image inspection equipment we have implemented.
The "Ky Technical Report" is a technical document that publishes technical information and special responses related to the manufacturing operations conducted by K-Y Electronics. In issue No. 025, we introduce the '3D Image Inspection Device' that was introduced in 2017. Our company previously conducted 100% inspection after the SMT process using a 2D image inspection machine (Omron RNS-VT-L). While the detection capability for un-soldered joints is very high with this equipment, it is a testing method that struggles to detect issues such as components/leads lifting or misalignment, which is why we introduced a 3D inspection device. Defects such as "the joint is made, but the lead is lifted, resulting in insufficient strength" can now be detected through our inspections. [Strengths] ■ Lifting ■ Tilt ■ Foreign matter ■ Solder height *Conditions apply *For more details, please refer to the PDF document or feel free to contact us.
- Company：ケイワイ電子工業
- Price：Other
